The main objective of this project is to explore novel effective corrosion protection and barrier layer concepts on base of spinel-based nanostructured materials and to establish one of these on the designated new metallic interconnect (MIC) material. The material combination of MIC and protection layer has to withstand SOFC typical operation conditions of 900°C, high humindity and electrochemical conditions. The protection layer needs to:

• reduce “intrinsic” chromium evaporation rate
• reduce the chromium Evaporation
• minimize the resistance increase by avoiding a thick and non-conductive Cr2O3 layer