Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)

Description

Meister Abrasives AG and ZHAW intend to develop a completely new process for the production of dicing blades for wafers used in high tech industries (semiconductors, MEMS). With the new process based on ceramic tape casting technology adapted to vitreous bonded diamond abrasives limitations of the current production process will be overcome. It will lead to thinner blades with controlled and tailorable microstructure using vitreous bond systems.

Left: New development of dicing blades, right: dicing grooves

Key Data

Projectlead

Prof. Dr. Dirk Penner

Project team

Michal Gorbar

Project partners

Meister Abrasives AG

Project status

completed, 12/2016 - 12/2019

Funding partner

KTI-Projekt / Projekt Nr. 25133.2 PFNM-NM

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